How to Apply
Thermal Putty.
Learn how to prepare, shape, apply, compress, and inspect thermal putty when servicing compatible VRAM, VRMs, and other electronics components that require a thermal gap filler.
Prepare the
Cooling Assembly.
Good thermal contact starts with a clean, correctly prepared assembly. Identify the components that originally relied on thermal pads or thermal gap-filling material before removing the existing interface.
Map Contact Areas
Note where the original gap-filling material contacts VRAM, VRMs, inductors, or other components before disassembly.
Remove Old Material
Carefully remove existing thermal pads, putty, and loose material from the intended contact areas.
Prepare the Surfaces
Make sure component and heatsink contact areas are clean and free from debris before applying fresh thermal material.
Check the Gap
Review the component height and available clearance so enough material can be used to create contact without unnecessary excess.
Apply. Compress.
Confirm Contact.
Thermal putty works by filling the available space between suitable components and the cooling assembly. The goal is complete contact after compression, not simply covering the component with the largest possible amount of material.
Take the Required Amount
Start with a controlled portion of putty appropriate for the component and estimated gap.
Form the Putty
Shape the material so it covers the intended thermal contact area without spreading unnecessarily across surrounding components.
Position on the Component
Place the shaped material on the compatible VRAM, VRM, or other intended thermal-contact area.
Install the Heatsink
Reinstall the cooling assembly evenly so the putty compresses and conforms to the available gap.
Confirm Contact
Make sure the assembly seats correctly and that the putty is providing contact without interfering with proper heatsink installation.
How Much Putty
Should You Use?
There is no single amount that applies to every device. Component dimensions, original pad thickness, heatsink clearance, and assembly pressure can all change the amount required.
Fill the Gap.
Don’t Fill the Board.
Use enough putty to create reliable compressed contact between the intended component and cooling surface. Excess material outside the required thermal-contact area generally does not improve the interface.
Begin Conservatively
Start with a controlled amount based on the size of the component and estimated gap.
Allow for Compression
The applied material needs enough height to compress against the cooling assembly.
Cover the Intended Area
Position material across the component area that must transfer heat to the cooling structure.
Follow the Device
Device designs vary, so follow the cooling layout and original interface requirements of the hardware being serviced.
Apply Where Needed.
Avoid Unnecessary Excess.
Controlled Application
- Match the material to the intended contact area.
- Leave enough height for compression.
- Keep surrounding components and connectors clear.
- Install the heatsink evenly.
- Confirm proper seating after assembly.
Excess or Incorrect Placement
- Do not cover the entire PCB with thermal putty.
- Do not apply material to components that were not designed to contact the cooling assembly.
- Do not use excessive material that prevents the heatsink from seating correctly.
- Do not assume every component requires the same gap thickness.
- Do not replace unrelated thermal-interface materials without confirming the cooling design.
Before You
Finish Reassembly.
Confirm Compression
Make sure the material is positioned to compress between the intended component and cooling surface.
Check Heatsink Seating
The cooling assembly should install correctly without being held away from the board by excessive material.
Inspect Surrounding Components
Make sure unnecessary material has not spread into connectors, sockets, mounting points, or other areas outside the intended thermal interface.
Common Thermal Putty
Application Questions.
Does thermal putty need to be spread into a thin layer?
Not necessarily. Thermal putty is used as a gap-filling material. It needs enough thickness to bridge the intended component-to-heatsink gap and compress during assembly.
Can thermal putty replace every thermal pad?
Not automatically. Cooling designs vary. Thermal pads can be preferable where a specific fixed thickness and repeatable geometry are required. Follow the needs of the device being serviced.
Can I use the same amount on every VRAM or VRM?
Component dimensions and heatsink clearances can vary. Use enough material to create compressed contact for each intended area rather than assuming every location requires exactly the same amount.
What if the heatsink will not seat correctly?
Stop and inspect the assembly. Excess material or incorrect placement can interfere with normal seating. Adjust the application before completing reassembly.
Ready to Fill the Gap?
Shop Thermal Putty.
14.8 W/m·K high-performance moldable thermal gap filler for compatible electronics cooling applications.