Solder Wire Product Guide

CHOOSE THE RIGHT MELT. BUILD A BETTER JOINT.

Professional solder wire for electronics repair, rework, and assembly. Choose 138°C lead-free Low Melt for reduced heat exposure or 183°C Sn63/Pb37 Medium Melt for dependable everyday soldering performance.

PolarTronix Solder Wire

Two Alloys.
Two Temperature Ranges.

Different soldering jobs require different thermal profiles. PolarTronix Low Melt and Medium Melt Solder Wire give technicians two professional options for precision electronics repair, rework, and assembly.

Low Melt / Lead-Free
138°C
280°F Melting Point

Sn42 / Bi58 Low Melt Solder Wire

Lead-free low-temperature solder wire designed for precision electronics repair and rework where reducing heat exposure can be beneficial.

Alloy
Sn42 / Bi58
Melting Point
138°C / 280°F
Wire Diameter
0.5 mm
Net Weight
50 g
Shop Low Melt
Medium Melt / Eutectic
183°C
361°F Melting Point

Sn63 / Pb37 Medium Melt Solder Wire

Eutectic solder wire designed for dependable everyday electronics soldering, PCB repair, assembly, and professional rework applications.

Alloy
Sn63 / Pb37
Melting Point
183°C / 361°F
Wire Diameter
0.8 mm
Net Weight
50 g
Shop Medium Melt
Which One?

Choose the Alloy for the Job.

Choose 138°C Low Melt when lower melting temperature and reduced heat exposure are important. Choose 183°C Medium Melt for dependable general electronics soldering and everyday professional repair work.

Low Melt vs. Medium Melt

Choose the Right
Solder for the Job.

Both PolarTronix solder wires are designed for professional electronics work, but their alloy, melting point, wire diameter, and ideal use cases differ. The right choice depends on how much heat the repair can tolerate and the type of soldering work being performed.

Specification
Low Melt
Medium Melt
Alloy
Sn42 / Bi58
Sn63 / Pb37
Composition
42% Tin / 58% Bismuth
63% Tin / 37% Lead
Melting Point
138°C / 280°F
183°C / 361°F
Lead-Free
Yes
No
Wire Diameter
0.5 mm
0.8 mm
Net Weight
50 g
50 g
Primary Advantage
Lower heat exposure
General-purpose soldering performance
Best Fit
Precision, delicate, heat-sensitive rework
Everyday electronics soldering and repair
Choose Low Melt When

Lower Heat Exposure Matters.

The 138°C Sn42/Bi58 alloy is especially useful when a lower melting temperature can help reduce the amount of heat introduced during delicate electronics rework.

  • Heat-sensitive components
  • Connector replacement
  • Precision microsoldering
  • BGA and board-level rework
  • Trace and pad repair
  • Lead-free low-temperature work
Choose Medium Melt When

You Need Everyday Soldering Performance.

The 183°C Sn63/Pb37 eutectic alloy is a dependable choice for general electronics soldering, repair, prototyping, assembly, and repeatable professional work.

  • General PCB repair
  • Through-hole soldering
  • Electronics assembly
  • Prototyping
  • Industrial and control boards
  • Everyday repair-bench soldering
Temperature Difference

45°C Separates the Two Alloys.

138°C
Low Melt
183°C
Medium Melt
Important

Melting Point Is Not Iron Temperature.

The 138°C and 183°C values describe the melting points of the solder alloys. Actual soldering-station temperature depends on factors such as joint size, tip geometry, thermal mass, equipment, workflow, and the components being serviced.

Ideal Applications

One Repair Bench.
Two Soldering Options.

Both PolarTronix solder wires are built for professional electronics work. The main difference is where each alloy provides the strongest advantage: Low Melt for lower-temperature precision rework, and Medium Melt for dependable everyday soldering.

01 / PCB REPAIR

Board-Level Repair

Suitable for professional circuit-board repair, component replacement, solder-joint service, and electronics rework.

02 / MICRO

Microsoldering

Useful for detailed electronics work where controlled solder delivery and consistent alloy behavior are important.

03 / SMD & SMT

Surface-Mount Work

Supports SMD and SMT repair workflows involving small electronic components and board-level connections.

04 / DEVICES

Phones & Tablets

Fits professional mobile-device repair, connector service, board repair, and component-level soldering workflows.

05 / CONSOLES

Game Console Repair

Suitable for console motherboard repair, connector service, component replacement, and general electronics rework.

06 / COMPUTERS

Laptops & Desktops

Useful for computer motherboard repair, power circuits, connectors, through-hole components, and general soldering.

Low Melt Stands Out For

Delicate & Heat-Sensitive Rework

The 138°C Sn42/Bi58 alloy is especially useful when reducing the amount of heat introduced to the repair area is a priority.

  • Heat-sensitive component work
  • Connector replacement
  • BGA repair and rework
  • Trace and pad repair
  • Fine-pitch electronics work
  • Lower-temperature assembly
Medium Melt Stands Out For

Everyday Professional Soldering

The 183°C Sn63/Pb37 eutectic alloy is a dependable general-purpose option for routine repair, assembly, prototyping, and professional electronics work.

  • Through-hole soldering
  • General PCB repair
  • Electronics assembly
  • Prototyping
  • Audio electronics
  • Industrial and control boards
Professional Electronics

Built for Repair, Rework & Assembly.

PCB Repair
Microsoldering
SMD / SMT
Connectors
Consoles
Mobile Devices
Computers
Prototyping
Alloy Selection

Match the Solder to the Repair.

The best solder wire is not determined by melting point alone. Consider the component, PCB construction, thermal sensitivity, joint size, soldering equipment, and the alloy already present when selecting the appropriate material.

Melting Temperature

Understand the Alloy.
Control the Heat.

The melting point tells you when the solder alloy transitions into a liquid state. PolarTronix Low Melt and Medium Melt Solder Wire use different alloys, giving technicians two distinct thermal profiles for different repair and assembly requirements.

Sn42 / Bi58 Low Melt
138°C
280°F Melting Point

Lower-Temperature Soldering Alloy

Sn42/Bi58 melts at 138°C, allowing the solder alloy to transition at a lower temperature than conventional Sn63/Pb37 solder. This can be useful when reducing thermal exposure during delicate electronics rework.

Sn63 / Pb37 Medium Melt
183°C
361°F Melting Point

Eutectic Soldering Alloy

Sn63/Pb37 is a eutectic alloy with a defined 183°C melting point, providing a direct transition between solid and liquid states during general electronics soldering and repair.

Important Distinction

Melting Point ≠
Soldering Iron Setting

The alloy melting temperature does not tell you exactly what temperature to set your soldering station. The iron tip must transfer enough energy into the joint for the solder and surrounding materials to reach the required working temperature.

01 / THERMAL MASS

Joint Size Matters

Large ground planes, connectors, and heavier joints absorb more heat than small component leads.

02 / TIP

Tip Geometry Matters

Tip shape and contact area influence how efficiently heat transfers from the soldering iron into the joint.

03 / EQUIPMENT

Station Performance Matters

Heater power, temperature recovery, calibration, and tip condition can all affect soldering performance.

04 / WORKFLOW

The Repair Matters

Component sensitivity, board design, existing alloy, flux, and repair technique all influence the working temperature required.

Step 01

Select the Alloy

Choose Low Melt or Medium Melt according to the repair, existing solder system, component sensitivity, and desired thermal profile.

Step 02

Match the Equipment

Use an appropriate soldering tip, station, and flux for the size and thermal mass of the joint being serviced.

Step 03

Control Heat Exposure

Use enough heat for efficient solder flow while avoiding unnecessary heating time around sensitive components and board materials.

Key Principle

Temperature Is Only Part of the Process.

Successful soldering depends on the complete thermal system—not just the number on the station display. Alloy, flux, joint mass, tip geometry, equipment performance, and contact time all work together during a soldering process.

Product Details

Two Professional
Solder Wire Formulas.

PolarTronix Low Melt and Medium Melt Solder Wire provide two distinct alloy and temperature options for professional electronics repair, rework, prototyping, and assembly.

138°C
Low Melt / Sn42-Bi58
183°C
Medium Melt / Sn63-Pb37
0.5 / 0.8 mm
Wire Diameter Options
50 g
Each Spool
Low Melt

Sn42 / Bi58

Lead-free low-temperature solder wire for precision and heat-sensitive electronics rework.

Alloy
Sn42 / Bi58
Composition
42% Tin / 58% Bismuth
Melting Point
138°C / 280°F
Lead-Free
Yes
Wire Diameter
0.5 mm
Net Weight
50 g
Best Fit
Precision rework, heat-sensitive components, connector service, BGA work, and detailed electronics repair
Medium Melt

Sn63 / Pb37

Eutectic solder wire for dependable everyday professional electronics soldering and assembly.

Alloy
Sn63 / Pb37
Composition
63% Tin / 37% Lead
Melting Point
183°C / 361°F
Lead-Free
No
Wire Diameter
0.8 mm
Net Weight
50 g
Best Fit
General PCB repair, through-hole soldering, electronics assembly, prototyping, and everyday professional bench work
Low Melt

Lower Heat Exposure

138°C melting point supports lower-temperature rework where reducing thermal stress is beneficial.

Medium Melt

Eutectic Performance

Sn63/Pb37 transitions directly at 183°C for dependable general electronics soldering.

Wire Control

0.5 mm & 0.8 mm

Two wire diameters support finer precision feeding and broader general-purpose solder delivery.

Professional Size

50 Gram Spools

Practical spool size for professional repair benches, technical labs, and regular soldering workflows.

Choose Your Solder Wire

138°C or 183°C — Match the Alloy to the Repair.

PolarTronix Professional Solder Wire

Two Melt Points.
One Professional Workflow.

Choose 138°C Sn42/Bi58 Low Melt for lower-temperature, precision electronics rework, or 183°C Sn63/Pb37 Medium Melt for dependable everyday soldering, PCB repair, assembly, and professional bench work.

Low Melt
138°C / 280°F
Sn42/Bi58 · Lead-Free · 0.5 mm · 50 g
Medium Melt
183°C / 361°F
Sn63/Pb37 · 0.8 mm · 50 g