A Controlled Process for
Professional Rework.
Proper preparation, controlled application, and careful heat management are essential when working with low-melt solder paste. Use only the amount required for the repair and adjust your process according to the PCB, component, and equipment being used.
Clean the Work Area
Make sure the soldering area is clean and free from contamination. Prepare the PCB pads or rework area as appropriate for the repair.
Apply a Controlled Amount
Dispense a small, controlled amount of solder paste onto the intended pads or soldering area. Avoid excessive application.
Align the Component
Carefully position and align the component with the PCB pads before applying heat.
Apply Controlled Heat
Apply heat using equipment appropriate for the component and repair process. Heat only as necessary to achieve proper solder reflow.
Cool & Inspect
Allow the assembly to cool naturally, then inspect the completed solder joints for proper alignment, wetting, and overall workmanship.
The 138°C melting point is not a universal hot-air, soldering iron, or reflow temperature setting. Actual equipment settings depend on factors such as PCB thermal mass, component size, airflow, heat transfer, and the specific repair procedure.