Choosing the Right Solder
Low Melt or
Medium Melt?
Different solder alloys are designed for different working conditions. The right choice depends on the repair, operating environment, original solder alloy, and desired processing temperature.
Low Melt
Sn42 / Bi58
Tin-Bismuth Eutectic Alloy
138°C
Temperature
Low-temperature soldering and rework
Lead-Free
Yes
Best For
Controlled low-temperature rework and applications
where reducing thermal exposure is beneficial.
Medium Melt
Sn63 / Pb37
Tin-Lead Eutectic Alloy
183°C
Temperature
Medium-temperature soldering
Lead-Free
No
Best For
General electronics soldering, board repair, and
applications requiring a conventional Sn63/Pb37
solder joint.
Which One Should You Use?
Choose Low Melt When:
Reducing processing temperature is an important part of the repair or rework procedure, especially when limiting unnecessary heat exposure is beneficial.
Choose Medium Melt When:
You need a conventional electronics solder alloy for general soldering, component installation, and board-level repair.