Medium Melt Solder Paste – Leaded – 35 Gram

Description

• PolarTronix® Medium Melt Solder Paste – Sn63/Pb37 • 183°C

  PolarTronix® Medium Melt Solder Paste is a professional-grade Sn63/Pb37 tin-lead solder paste engineered for precision PCB rework, microsoldering, component installation, and electronics repair.

  The eutectic 63% tin / 37% lead (Sn63/Pb37) alloy has a melting point of approximately 183°C (361°F), providing a sharp transition from solid to liquid without a broad pasty melting range. This predictable melting behavior gives technicians greater control during precision soldering and helps produce consistent, reliable solder joints.

  Sn63/Pb37 Eutectic Alloy

  The Sn63/Pb37 composition is widely used for electronics soldering because of its excellent flow characteristics, wetting performance, and predictable 183°C melting point.

  Unlike non-eutectic solder alloys that transition through a temperature range, Sn63/Pb37 transitions at approximately 183°C. This makes it especially useful for controlled PCB rework and applications where repeatable soldering behavior is important.

  Designed for Professional Electronics Repair

  PolarTronix® Medium Melt Solder Paste is formulated for board-level electronics repair and precision rework applications, including:

  • SMD and SMT component installation
  • PCB rework and repair
  • Microsoldering
  • IC and small component replacement
  • Connector and port repair
  • Solder pad preparation and tinning
  • Smartphone and tablet logic board repair
  • Laptop and computer motherboard repair
  • Game console PCB repair
  • General electronics prototyping and rework

  Controlled 183°C Melting Point

  With a melting point of approximately 183°C (361°F), this medium-melt solder paste provides a useful balance between standard electronics soldering temperatures and lower-temperature rework alloys.

  The controlled melting point makes it suitable for technicians who need predictable solder flow while performing component installation, pad preparation, connector replacement, and other board-level repairs.

  Smooth Flow & Wetting

  The solder paste is designed to promote consistent solder flow across properly prepared copper pads and component contacts. When used with appropriate soldering or hot-air equipment, it allows the solder to reflow into smooth, controlled joints while helping technicians maintain precision around small PCB components.

  Precision Syringe Application

  Packaged in a syringe for controlled dispensing, the paste can be applied directly to individual pads, component footprints, connectors, and other targeted PCB areas. This helps reduce unnecessary material use and provides better control during detailed microsoldering work.

  Ideal for Repair Technicians

  Developed with professional electronics repair environments in mind, PolarTronix® Medium Melt Solder Paste is suitable for technicians working on:

  Smartphones • Tablets • Laptops • Desktop Computers • Game Consoles • PCBs • Electronic Modules • Connectors • SMD/SMT Components

  Technical Specifications

  Alloy: Sn63/Pb37
  Composition: 63% Tin / 37% Lead
  Melting Point: 183°C / 361°F
  Alloy Type: Eutectic Tin-Lead
  Application: PCB Rework & Electronics Repair
  Dispensing: Precision Syringe
  Recommended Use: Professional electronics soldering, microsoldering, component installation and PCB rework

  Important

  This product contains lead. Use appropriate handling procedures and follow applicable workplace and local regulations. Wash hands thoroughly after handling and keep away from children.

  PolarTronix® — Built for Professionals.