Controlled Application.
Consistent Results.
Proper flux use starts with a clean work area and controlled application. Use only the amount needed to support the soldering process, then adjust your technique according to the component, PCB, solder alloy, and equipment being used.
Prepare the Work Area
Make sure the PCB, pads, leads, terminals, or other soldering surfaces are appropriately prepared before applying flux.
Apply a Controlled Amount
Apply a small amount of flux directly to the soldering area. Use enough to support wetting without flooding the surrounding PCB.
Apply Solder & Heat
Perform the soldering process using the appropriate solder alloy, tool temperature, airflow, and technique for the specific component and PCB.
Allow the Joint to Cool
Allow the soldered area to cool naturally before moving the component or performing final inspection.
Inspect the Work
Inspect solder joints, component alignment, and the surrounding repair area. Clean remaining residue if required by the repair process or workplace procedure.
More flux is not always better. Excessive application can create unnecessary residue and make the work area harder to inspect. Use a controlled amount appropriate for the size and type of soldering operation.