Medium Melt Solder Paste
Sn63 / Pb37 • 183°C MELTING POINT
Professional solder paste formulated for reliable electronics soldering, component installation, microsoldering, and board-level repair.
Reliable Soldering.
Proven Alloy.
Sn63/Pb37 has long been used for professional electronics soldering because of its predictable melting behavior and defined 183°C melting point. PolarTronix Medium Melt Solder Paste is designed for general board-level soldering, component installation, microsoldering, and electronics repair where a conventional tin-lead solder alloy is appropriate.
Defined melting temperature for controlled electronics soldering and reflow.
Tin forms the primary component of the Sn63/Pb37 solder alloy.
Combined with tin to create the conventional Sn63/Pb37 electronics solder composition.
Professional-size solder paste container for electronics repair and board-level work.
Predictable Melting Behavior
Sn63/Pb37 is a eutectic alloy, meaning it transitions between solid and liquid at a defined temperature rather than moving through a broad pasty temperature range.
Built for General Electronics Work
Its 183°C melting point makes Sn63/Pb37 a practical choice for many board-level soldering, component installation, connector repair, and microsoldering applications.
The 183°C melting point describes the solder alloy and should not be interpreted as a universal soldering iron, hot-air, or reflow setting. Actual process temperatures depend on the PCB, component, thermal mass, equipment, airflow, and soldering procedure.
Built for Everyday
Board-Level Soldering.
PolarTronix Medium Melt Solder Paste is designed for professional electronics repair where a conventional Sn63/Pb37 solder alloy is appropriate. Its 183°C melting point makes it a practical choice for a wide range of component installation, repair, and rework procedures.
Component Installation
Suitable for installing and replacing surface-mount components during professional electronics repair, assembly, and board-level rework.
Connectors & Ports
A practical solder alloy for controlled repair and replacement of PCB-mounted connectors, ports, and other multi-point soldered components.
Microsoldering & PCB Repair
Designed for detailed board-level work including microsoldering, component replacement, trace-area repair, and precision electronics servicing.
General Electronics Rework
Well suited for professional repair of smartphones, tablets, laptops, game consoles, computers, and other electronic assemblies where Sn63/Pb37 is appropriate.
Medium Melt Sn63/Pb37 is intended for controlled electronics soldering and rework. Material selection should always consider the original solder alloy, component requirements, and operating conditions of the repaired assembly.
What Makes Sn63/Pb37
Different?
PolarTronix Medium Melt Solder Paste uses the classic Sn63/Pb37 composition: 63% tin and 37% lead. This eutectic alloy has a defined melting point of approximately 183°C, giving technicians predictable melting behavior during professional electronics soldering and rework.
What Does “Eutectic” Mean?
A eutectic solder alloy transitions between solid and liquid at a defined temperature rather than softening gradually through a broad temperature range. For Sn63/Pb37, that transition occurs at approximately 183°C.
Why It Matters
Predictable melting behavior gives technicians a consistent process window for many component installation, PCB repair, connector, and general electronics soldering applications.
Sn63/Pb37 contains lead and should be handled using appropriate professional safety and hygiene practices. Always consider the original solder alloy, component requirements, and operating conditions when selecting solder for a repair.
Use the Right Alloy.
Control the Process.
Sn63/Pb37 is widely used in professional electronics soldering, but reliable results still depend on correct material selection, surface preparation, controlled application, and appropriate soldering conditions.
Sn63/Pb37 Contains Lead
Medium Melt Sn63/Pb37 is a lead-containing solder alloy. Appropriate workplace hygiene, ventilation, handling, storage, and disposal practices should be followed according to the product Safety Data Sheet and applicable regulations.
Match the Application
Consider the original solder alloy, component requirements, operating environment, and intended use of the assembly before selecting Sn63/Pb37 for repair or rework.
Manage Heat Carefully
Adjust temperature, airflow, heating time, and technique based on the PCB thermal mass, component size, equipment, and specific soldering procedure.
Control Paste Volume
Apply only the amount of solder paste required for the joint. Excess material can contribute to bridging, residue, and inconsistent solder formation.
Maintain Good Hygiene
Keep soldering areas clean, follow appropriate hand-washing practices after handling lead-containing materials, and follow the current SDS for workplace precautions.
Always review the current Safety Data Sheet before use. Medium Melt Solder Paste is intended for professional electronics soldering and repair where Sn63/Pb37 is appropriate for the application.
Built for
Professional Soldering.
PolarTronix Medium Melt Solder Paste uses the classic Sn63/Pb37 eutectic alloy with a 183°C melting point for reliable component installation, microsoldering, connector repair, and professional board-level electronics work.
Technical
Specifications.
Key technical information for PolarTronix Medium Melt Solder Paste, formulated with the conventional Sn63/Pb37 eutectic alloy for professional electronics soldering and board-level repair.
Sn63/Pb37 contains lead. Follow appropriate workplace handling and hygiene procedures and review the current product Safety Data Sheet before use.
Refer to the current product Safety Data Sheet for complete storage, handling, personal-protection, disposal, and other safety information.