Professional Service
Use the Correct Interface
Follow the cooling design and clearance requirements of the device being serviced rather than replacing every interface material with the same solution.
Thermal Putty Product Guide
FILL THE GAPS.
CONTROL THE HEAT.
High-performance thermal putty designed to conform around VRAM, VRMs, and other heat-generating components for reliable heat transfer across uneven gaps.
Advanced Thermal Gap Filling
Conforms to Gaps. Transfers the Heat.
PolarTronix Thermal Putty is a high-performance, moldable thermal interface material designed to fill uneven spaces between heat-generating electronic components and cooling hardware. Unlike fixed-thickness thermal pads, putty conforms to the available gap and compresses as the heatsink is installed.
01 / GAP FILLING
Conforms to Uneven Gaps
Moldable consistency allows the material to adapt to variations in component height and heatsink spacing.
02 / THERMAL TRANSFER
14.8 W/m·K Performance
High thermal conductivity supports heat transfer from compatible electronic components toward the cooling assembly.
03 / COMPRESSION
Adapts During Assembly
The soft material can compress and conform as the cooling hardware is installed, helping accommodate variable component clearances.
04 / APPLICATION
Shape Where Needed
Apply and shape the putty around suitable thermal-contact areas instead of cutting individual fixed-size pads.
Why Thermal Putty?
Components Are Not Always the Same Height.
VRAM, VRMs, inductors, and surrounding components can sit at different heights across an electronics assembly. Thermal putty is designed to conform around those variations and create contact between suitable components and the cooling structure above them.
01 / VRAM
Memory Cooling
Suitable for compatible VRAM thermal-contact areas where a conformable gap filler is required.
02 / VRM
Power Components
Helps bridge appropriate gaps between power-delivery components and cooling hardware.
03 / VARIABLE GAP
Irregular Clearances
Conforms where component height or heatsink clearance makes a single fixed pad thickness less practical.
04 / HEATSINK
Cooling Contact
Compresses between compatible components and cooling surfaces as the assembly is brought together.
14.8 W/m·K
Thermal Conductivity
50 g
Professional Jar Size
Moldable
Variable Gap Filling
Thermal Gap Filler
One Material. Multiple Gap Heights.
Thermal putty is especially useful in cooling assemblies where different components require different amounts of gap-filling material. Its moldable format allows the material to conform during assembly rather than relying on a single pre-cut thickness.
Thermal Putty vs. Thermal Pads
Different Formats. Different Advantages.
Thermal putty and thermal pads perform a similar basic job: helping transfer heat across a gap between electronic components and cooling hardware. The difference is how each material adapts to the space it needs to fill.
Thermal Putty
Conforms to the Gap
Thermal putty is soft and moldable, allowing it to adapt to varying clearances across multiple components within the same cooling assembly.
- Adapts to variable component heights
- No fixed pad thickness required
- Can be shaped around irregular contact areas
- Compresses during heatsink installation
- Useful across mixed gap sizes
Thermal Pads
Provides a Fixed Thickness
Thermal pads are pre-formed sheets with a defined thickness, making them useful when the required gap size and contact geometry are already known.
- Consistent fixed thickness
- Easy to cut into defined shapes
- Useful for known gap dimensions
- Clean pre-formed installation format
- Well suited to repeatable layouts
| Comparison | Thermal Putty | Thermal Pads |
|---|---|---|
| Gap Thickness | Variable / Conformable | Fixed thickness |
| Shape | Moldable | Pre-formed sheet |
| Preparation | Shape required amount | Measure and cut |
| Uneven Heights | Naturally accommodates variation | May require multiple thicknesses |
| Repeatable Geometry | Manually shaped | Precise pre-cut format |
| Typical Use | Variable VRAM / VRM / component gaps | Known component-to-heatsink gaps |
Choose Putty When
Gap Heights Vary
Putty is especially useful when several components sit at different heights and must contact the same cooling assembly.
Choose Pads When
Thickness Is Known
Pads remain a practical choice when the required thickness, component layout, and contact area are already clearly defined.
Key Difference
Pads Match a Thickness. Putty Adapts to the Gap.
Thermal putty is not simply a softer thermal pad. Its main advantage is conformability: the material can adapt to component-height differences and irregular clearances within compatible cooling assemblies.
Ideal Applications
Built for Variable Thermal Gaps.
PolarTronix Thermal Putty is designed for electronics cooling assemblies where component heights and heatsink clearances vary. Its moldable format makes it especially useful across VRAM, VRMs, consoles, laptops, GPUs, and other compact thermal-management applications.
01VRAM
Memory Modules
Fill suitable gaps between VRAM packages and the cooling plate or heatsink in GPUs, consoles, laptops, and other high-performance electronics.
02VRM
Power Delivery
Conforms around compatible MOSFETs, power stages, and other VRM components that require contact with surrounding cooling hardware.
03GPU
Graphics Cards
Useful for GPU cooling assemblies where multiple components sit at different heights beneath the same heatsink or cooling plate.
04CONSOLES
PS5 & Xbox Series X
Suitable for compatible console cooling areas where moldable thermal gap material is required around memory, power-delivery, or supporting components.
05LAPTOPS
Laptop Cooling
Adapts well to compact laptop cooling assemblies where fixed-thickness pads may need to accommodate several different component heights.
06COMPACT SYSTEMS
Mini PCs & Electronics
Useful in compact electronic assemblies with limited clearance and irregular component-to-heatsink gap requirements.
Why These Applications?
One Heatsink. Many Component Heights.
Modern electronics often place memory, power-delivery, inductors, and other components beneath one shared cooling structure. Thermal putty can adapt to those height differences while maintaining thermal contact across suitable areas.
Important
Follow the Device’s Cooling Design.
Thermal putty is intended for compatible thermal-gap applications. It should not automatically replace every thermal pad or interface material in a device. Use the correct material for the component, clearance, and cooling design being serviced.
01MEMORY
VRAM Cooling
Helps bridge appropriate gaps between memory packages and surrounding cooling surfaces.
02POWER
VRM Components
Conforms around suitable power components where heatsink clearance varies across the assembly.
03COMPACT
Tight Assemblies
Moldable material can be practical where there is limited room for measuring and cutting several pad thicknesses.
04VARIABLE
Mixed Gap Heights
Accommodates different clearances across compatible components within one cooling layout.
Compression & Contact
Shape the Putty. Let the Assembly Compress It.
Thermal putty is designed to deform as the cooling assembly is installed. Proper application leaves enough material to bridge the intended gap while allowing the heatsink or cooling plate to seat correctly.
01
Place
Position the Material
Shape and place the putty over the intended compatible thermal-contact area before reinstalling the cooling assembly.
02
Assemble
Bring the Surfaces Together
Install the heatsink or cooling plate evenly so the putty begins conforming to the component and available gap.
03
Compress
Fill the Available Space
As the assembly seats, the material compresses and spreads within the intended thermal-contact area.
04
Verify
Confirm Proper Seating
The cooling assembly should reach its normal installed position without being held away by unnecessary excess material.
Application Goal
Enough to Make Contact. Not Enough to Block Assembly.
Thermal putty should bridge the required component-to-heatsink clearance and compress as the device is reassembled. More material is not automatically better.
01
HEIGHT
Leave Compression Height
Apply enough material so the putty contacts both surfaces once the cooling assembly is installed.
02
CONTACT
Cover the Intended Area
Shape the putty around the thermal-contact region rather than spreading it unnecessarily across the PCB.
03
SEATING
Preserve Heatsink Position
The amount of putty should not prevent screws, brackets, heatsinks, or cooling plates from reaching their normal installed position.
04
DEVICE
Follow the Hardware
Different devices and component locations can require different amounts of gap-filling material.
Proper Application
Compressed Contact
- Material contacts the intended component.
- Putty reaches the cooling surface after assembly.
- The material compresses within the available gap.
- Cooling hardware seats normally.
- Excess material remains limited to the intended area.
Avoid
Excessive Material
- ×Do not use large amounts simply to fill open space.
- ×Avoid spreading putty across unrelated PCB areas.
- ×Do not allow excess material to obstruct connectors or mounting points.
- ×Do not force the cooling assembly closed against an excessive amount of putty.
- ×Recheck the application if the heatsink does not seat normally.
Remember
Contact Matters More Than Quantity.
The objective is not to use as much thermal putty as possible. The objective is to create a properly compressed thermal path between compatible components and the cooling structure while maintaining correct device assembly.
Product Details
High-Performance Thermal Gap Filler.
PolarTronix Thermal Putty combines high thermal conductivity with a soft, moldable, non-conductive format designed for filling variable gaps across compatible electronics cooling assemblies.
14.8 W/m·K
Thermal Conductivity
50 g
Professional Jar
Non-Conductive
Electrical Properties
Moldable
Variable Gap Filling
Technical Overview
Product TypeHigh-performance thermal putty / moldable thermal gap filler
Thermal Conductivity14.8 W/m·K
Net Weight50 gram jar
Electrical PropertyNon-conductive
Material FormatSoft, moldable, compressible thermal gap-filling compound
Primary ApplicationsVRAM, VRMs, MOSFETs, coils, power components, and other compatible component-to-heatsink gap applications
Device ApplicationsGPUs, laptops, PS5, Xbox Series X, compact PCs, electronics repair, and compatible thermal-management assemblies
Gap TypeVariable and irregular component-to-cooling-surface gaps
Performance
14.8 W/m·K
High thermal conductivity supports heat transfer between compatible components and cooling hardware.
Electrical
Non-Conductive
Designed as an electrically non-conductive thermal gap-filling material for electronics applications.
Conformability
Moldable Format
Can be shaped and compressed to accommodate variable component heights and irregular clearances.
Professional Use
50 Gram Jar
Larger jar format provides material for repeated repair, refurbishment, and thermal-management projects.
Typical Applications
Built for Modern Electronics Cooling.
VRAMVRMMOSFETsCoilsGPULaptopsPS5Xbox Series X
Thermal Interface Selection
Use the Right Material for the Gap.
Thermal putty is designed for compatible gap-filling applications and should be selected according to the device’s cooling design, component clearance, and thermal interface requirements. It should not automatically replace every thermal pad or thermal compound in an assembly.
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Fill the Gaps. Control the Heat.
High-performance 14.8 W/m·K non-conductive thermal putty designed to conform around VRAM, VRMs, MOSFETs, coils, and other compatible electronics components with variable thermal-gap requirements.
14.8 W/m·K•50 g•Non-Conductive•Moldable Gap Filler